Form Factor
3.5" baseboard (For ETX CPU Modules)

Chipsets
SMSC FDC37C669 Super I/O
Intel® 82599 Fast Ethernet Controller
Ti PCI1410 Cardbus controller

Battery
Lithium Battery for real time clock

LAN
RJ45 connector for LAN1

Pin Header for LAN2
USB
Pin header (4 port)

PCMCIA
Cardbus connector

Compact Flash
CF Card connector, support Type

Keyboard, Mouse Connector
PS2 type connector (6-pin mini din)

VGA Connector
DB15 slim-type connector
LVDS Panel Connector
Hirose DF13 Connector x 2

COM Ports Connector
DB9 slim-type connector for COM1
Pin Header for COM2,COM3,COM4
COM1,COM2 - RS232, RS422, RS485
COM3,COM4 - RS232

Floppy Connector
Pin Header

Parallel Port Connector
Pin Header

Digital I/O
Pin Header , Supports 4-In and 4-Out

Expansion Slot
PC/104

PCB Layer
4 Layers

Board Size
101mm x 146mm

环境条件

Operating Temperature
0C~60C (32F~140F)

Storage Temperature
-20C~80C (-68F~176F)

Relative Humidity
10%~90% (non-condensing)

订购信息

IP300 3.5" backplane for ETX CPU Module w/ 1 x Intel® 82599 Fast Ethernet Controller, TI1410 CardBus, w/o cable kit(IB15)

IB15 cable kit 2 x IDE, 2 x USB, COM, Printer, FDD, LAN, Audio, PS2, Power cable for IP300